Heavy Copper Weight PCBs #
For traditional high-power requirements, PCB Connect Group can produce boards with up to 12 oz inner and outer layer copper, and up to 6 oz inner and outer layer copper with UL approval.
Where the design has to carry high current and manage significant thermal load, reliability is decided long before the board is built. We match the design to a factory with proven heavy copper process control – etch compensation, resin fill between thick conductors, lamination and plating – and follow the production to make sure the result is repeatable, batch after batch.
• Up to 12 oz inner and outer layer copper
• Up to 6 oz inner and outer layer copper with UL approval
• Board thickness from 0.15 mm up to 10 mm (14 mm advanced)
• Mixed copper weight and hybrid stack-ups for combined power and control
HDI PCBs #
Miniaturisation is now standard in low-power applications, and increasingly in harsh environments too. Design, specification and manufacture of HDI technology are more interlinked than ever before.
With proven manufacturing capability, PCB Connect Group provides a full span of HDI capability to IPC-2226 Level C, from simple Type I through to complex Type V.
• Conductor widths, isolation distances and dielectric thicknesses below 50 µm in some cases
• Microvia diameters below 75 µm
• Sequential build-up, stacked and staggered vias, up to 6+N+6
• Line width and spacing from 0.045/0.045 mm
The result is the reliability and repeatability your new product needs – on a smaller footprint.
Thermal management and materials #
Power electronics fail where heat accumulates. We select the material set with the thermal path in mind, not just the price per panel.
• Metal-core (IMS) – aluminium and copper base with a range of thermal conductivities
• Ceramic and PTFE materials for extreme thermal or high-frequency requirements
• Hybrid laminates – for example FR4 combined with Rogers
• High-Tg and halogen-free FR4 from certified suppliers including Shengyi, KB, Nan Ya, ITEQ, Panasonic, Isola, Rogers, TUC and Ventec
• Thermal vias, copper coins and heavy copper planes where the design calls for them.
Also available for energy and power builds #
• Rigid PCBs from 1 to 60 layers (up to 120 layers advanced)
• Flex up to 8 layers and flex-rigid up to 36 layers for busbar-to-board and sensor interconnects
• Panel sizes up to 1800 × 600 mm (2 layer) and 720 × 1200 mm (multilayer)
• Aspect ratio up to 25:1 (28:1 advanced)
• Controlled impedance ±5 Ω (<50 Ω) / ±10 % (≥50 Ω)
• Surface finishes including HASL-LF, ENIG, immersion tin and silver, OSP, ENEPIG and hard gold
